Tundra Semiconductor Developing Host Bridge for Next-Generation PowerPC Processor from Freescale
Tsi108 Host Bridge Designed to Support High-Performance PowerPC(TM) Solutions
Smart Networks Developer Forum, FRANKFURT, Germany, Sept. 28 /PRNewswire- FirstCall/ -- Tundra Semiconductor (TSX:TUN), the leader in System Interconnect, today announced that it is developing the Host Bridge companion device for a next-generation, high- performance PowerPC processor from Freescale Semiconductor, the MPC7448 discrete processor.
The Tundra Tsi108(TM) PowerPC Host Bridge, an industry leader in terms of performance and integration levels, is a result of a co-development agreement announced in September 2003 as part of a Host Bridge product line acquisition from Freescale Semiconductor. The Host Bridge will be delivered to customers in the first half of calendar year 2005.
The September 2003 product line acquisition positioned Tundra as the leader in the Host Bridging market. The products - the Tundra Tsi106 and the Tundra Tsi107 Host Bridges - are the industry standard and are used by companies in the communications, wireless and printer markets. Applications include routers, printers, and wireless base stations. The Tsi108 will support Gigabit Ethernet as well as PCI-X. The Tsi108 supports other advanced features that customers have asked for and will be announced when the device is released for sampling.
"Freescale is committed to providing our PowerPC processor customers with best-in-class solutions," said Bill Dunnigan, Vice President and General Manager of Freescale's Computing Platform Division. "Close collaboration between Freescale and Tundra helps ensure that we're delivering products that interoperate seamlessly and deliver high-performance capability."
"The ongoing co-development of next generation PowerPC Host Bridging technology attests to the strength of our relationship with Freescale," says Rick O'Connor, Chief Technology Officer at Tundra. "As an extension to Tundra's PowerPC product portfolio, which is the most complete in the industry, it reinforces our commitment to continue to deliver PowerPC products that our customers value."
About Tundra
Tundra Semiconductor Corporation designs, develops, and markets standards- based System Interconnect for use by the world's leading communications and storage system companies. Tundra supports RapidIO, VME, and PCI/X standards. Tundra System Interconnect is a vital communications technology that enables customers to connect critical system components while compressing development cycles and maximizing performance. Applications include wireless infrastructure, storage networking, network access, military applications, and industrial automation. Tundra headquarters are located in Ottawa, Ontario, Canada. The Company also has a design center in South Portland, Maine, and sales offices in the U.K., across the US and in Asia. Tundra sells its products worldwide through a network of direct sales personnel, independent distributors and manufacturers' representatives. Tundra employs about 200 employees worldwide.
Design. Connect. Go.(TM)
TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S. and U.K.). TUNDRA, the Tundra logo, Tsi106, Tsi107, Tsi108 and Design. Connect. Go. are trademarks of Tundra Semiconductor Corporation. Other registered and unregistered trademarks are the property of their respective owners.
(C) Copyright 2004 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.
CONTACT: Stacey Diffin-Lafleur, Tundra Semiconductor Corp.,
(613) 592.0714 Ext. 1820, Stacey.diffin-lafleur@tundra.com
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